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How to screen electronic components scientifically
07/23/2021
Electronic components need to be screened by strict scientific and effective methods, and different modes should be selected to make them pass relevant tests to further improve the reliability of electronic components in use.
Power aging method: complete electronic components may seem to have no problems, but they will expose various problems in the actual use process.
Under certain ambient temperature, it can simulate the actual working state of electronic components, add a certain amount of electrical stress to components, accelerate various physical and chemical reactions inside the components through the comprehensive action of electrical stress, and promote the various defects hidden in the components to be fully exposed as soon as possible, so as to eliminate early failure products.
This method can effectively eliminate some problems that may exist in the manufacturing process, such as poor lead welding, electric leakage, silicon chip cracks and other defects, which can be accurately screened. For normal components without problems, aging can also promote the electrical parameters of components to become stable.
Appearance and internal quality inspection: visual inspection and mirror inspection are mainly used for the appearance quality inspection of basic components.
Visual inspection is to use a microscope and magnifying glass to check whether the appearance of components is obviously damaged, such as whether the lead is broken, whether the skeleton is damaged, etc., and whether the models match. For the adjustable components of electronic components, check whether they are within the adjustment range and the contact points are good, and remove the components with the above problems or any other problems.
For the internal inspection of components, mirror inspection technology is mainly used to screen chip welding, wire bonding, packaging defects, etc. This method is efficient and simple.
Power aging method: complete electronic components may seem to have no problems, but they will expose various problems in the actual use process.
Under certain ambient temperature, it can simulate the actual working state of electronic components, add a certain amount of electrical stress to components, accelerate various physical and chemical reactions inside the components through the comprehensive action of electrical stress, and promote the various defects hidden in the components to be fully exposed as soon as possible, so as to eliminate early failure products.
This method can effectively eliminate some problems that may exist in the manufacturing process, such as poor lead welding, electric leakage, silicon chip cracks and other defects, which can be accurately screened. For normal components without problems, aging can also promote the electrical parameters of components to become stable.
Appearance and internal quality inspection: visual inspection and mirror inspection are mainly used for the appearance quality inspection of basic components.
Visual inspection is to use a microscope and magnifying glass to check whether the appearance of components is obviously damaged, such as whether the lead is broken, whether the skeleton is damaged, etc., and whether the models match. For the adjustable components of electronic components, check whether they are within the adjustment range and the contact points are good, and remove the components with the above problems or any other problems.
For the internal inspection of components, mirror inspection technology is mainly used to screen chip welding, wire bonding, packaging defects, etc. This method is efficient and simple.